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AIM Micro Systems GmbH

Booth number: 4529-04

www.aim-micro-systems.de
stephan.karl@aim-micro-systems.de

About us

The assembly & packaging department of AIM Micro Systems is providing an independent manufacturing service for image and line-scan sensors in a clean room ISO 5 or 100 Fed. Std. 209E environment. We offer the complete assembly process, starting from wafer dicing (up to 12”), chip bonding, wire bonding, encapsulation, final test and a complete optic measurement including supply chain management. AIM provides a fast prototyping service down to 24 hours on serial equipment.

Our range of technologies includes: 

  • Image sensor assembly for vacuum and low temperature environment (CTE match and low outgassing)
  • Chip bonding on AlSi, Covar, Invar and other special materials
  • Chip attach on peltier elements
  • Chip stitching 
  • FOB (fiber optical block) including scintillator direct attach to image sensors 
  • Seam welding N² for hermetic environment 
  • Design of image sensor packages

We offer solutions for the follow applications:

  • Space 
  • X-Ray 
  • E-beam 
  • Machine vision 
  • Low temperature / vacuum


Products and services

Assembly & packaging in a clean room ISO 5 or 100 Fed. Std. 209E

Assembly & packaging in a clean room ISO 5 or 100 Fed. Std. 209E

The assembly & packaging department of AIM Micro Systems is providing an independent manufacturing service for image and line-scan sensors in a clean room ISO 5 or 100 Fed. Std. 209E environment. We offer the complete assembly process, starting from wafer dicing (up to 12”), chip bonding, wire bonding, encapsulation, final test and a complete optic measurement including supply chain management. AIM provides a fast prototyping service between 10 working days down to 24 hours on serial equipment.

Wafer dicing service up to 12

Wafer dicing service up to 12

Our range of technologies includes:
• Image sensor assembly for vacuum and low temperature environment (CTE match and low outgassing)
• Chip bonding on AlSi, Covar, Invar and other special materials
• Chip attach on peltier elements
• Chip stitching
• FOB (fiber optical block) including scintillator direct attach to image sensors
• Seam welding N² for hermetic environment
• Design of image sensor packages

Manufacturing service for image and line-scan sensors

Manufacturing service for image and line-scan sensors

We offer solutions for the follow applications:
• Space
• X-Ray
• E-beam
• Machine vision
• Low temperature / vacuum
• High Performance
• Consumer

Contacts

Address
AIM Micro Systems GmbH
Im Bresselsholze 8
07819 Triptis
Germany

Phone: +49 36482 88949-70
Fax: +49 36482 88949-99

Stephan, Karl
Head of Business Development Assembly & Packaging
Phone: +49 36482 88949-70
stephan.karl@aim-micro-systems.de


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J. Hauser GmbH & Co. KG
Booth number: 4529-62